Okuhlosiwe kwe-sputterizinto ezisetshenziselwa ukufaka amafilimu amancanyana kuma-substrates ngesikhathi senqubo ye- physical vapor deposition (PVD). Into eqondiwe ishaywa ngama-ion anamandla aphezulu, okubangela ukuthi ama-athomu akhishwe endaweni okuhlosiwe. Lawa ma-athomu afuthwe abe esefakwa ku-substrate, enze ifilimu elincanyana. Izinhloso ze-sputtering zivame ukusetshenziswa ekukhiqizeni ama-semiconductors, amaseli elanga nezinye izinto zikagesi. Ngokuvamile zenziwe ngezinsimbi, ama-alloys noma ama-compounds akhethiwe ngokusekelwe ezintweni ezifunwayo zefilimu efakiwe.

Inqubo ye-sputtering ithintwa yimingcele eminingana, kufaka phakathi:

1. Amandla okufafaza: Inani lamandla asetshenziswa phakathi nenqubo yokufafaza lizothinta amandla ama-ion afafaziwe, ngaleyo ndlela lithinte izinga lokufafaza.

2. Ukucindezela kwegesi okufafazayo: Ukucindezela kwegesi efafazayo ekamelweni kuthinta ukudluliswa komfutho kwama-ion afafaziwe, ngaleyo ndlela kuthinte izinga lokufafaza nokusebenza kwefilimu.

3. Izici eziqondiwe: Izakhiwo ezingokoqobo nezamakhemikhali zethagethi yokufafaza, njengokwakheka kwayo, ukuqina, indawo encibilikayo, njll., ingathinta inqubo yokufafaza nokusebenza kwefilimu ediphozithiwe.

4. Ibanga phakathi kwethagethi ne-substrate: Ibanga phakathi kwethagethi ye-sputtering kanye ne-substrate izothinta indlela kanye namandla ama-athomu ahlakazekile, ngaleyo ndlela kuthinte izinga lokubeka nokufana kwefilimu.

5. Ukuminyana kwamandla: Ukuminyana kwamandla asetshenziswa endaweni okuqondiswe kuyo kuthinta izinga lokufafaza nokusebenza kahle kwenqubo yokufafaza.

Ngokulawula ngokucophelela kanye nokwenza kahle le mingcele, inqubo ye-sputtering ingalungiswa ukuze kuzuzwe izici zefilimu ezifiselekayo kanye namazinga okufakwa.