99.95% Ithagethi ecocekileyo yeTantalum Sputtering
Iithagethi ze-Tantalum sputtering zihlala ziveliswa kusetyenziswa iinkqubo zesinyithi somgubo.
Ngale ndlela, i-tantalum powder iyadityaniswa kwaye ifakwe kwi-sintered ukwenza ipleyiti ye-tantalum eqinileyo. Amaphepha ane-sintered acutshungulwa ngokweenkqubo ezahlukeneyo zokubumba, ezinje ngoomatshini okanye ukuqengqeleka, ukufumana imilinganiselo efunwayo kunye nokugqiba komphezulu. Imveliso yokugqibela ke iyacocwa kwaye ihlolwe ukuze kuqinisekiswe ukuba iyahlangabezana nemigaqo efunekayo kwisicelo se-sputtering. Le ndlela yokuvelisa iqinisekisa ukuba iithagethi ze-tantalum sputtering zinokucoceka okuyimfuneko, ukuxinana kunye ne-microstructure ukufezekisa ukusebenza kakuhle kwiinkqubo zokubeka ifilimu encinci.
Iithagethi ze-Tantalum sputtering zisetyenziswa kwinkqubo yokubeka isitshizi, indlela yokufaka iifilimu ezibhityileyo zezinto ezahlukeneyo kwi-substrate. Kwimeko yojoliso lwe-tantalum sputtering, lusetyenziselwa ukufaka iifilimu ezicekethekileyo ze-tantalum kwiindawo ezahlukeneyo, ezinje nge-semiconductor wafers, ii-coatings zokubonisa, kunye nezinye izinto ze-elektroniki. Ngexesha lenkqubo yokubeka i-sputter, i-tantalum sputtering target ihlaselwe yi-ion ene-eneji ephezulu, ebangela ukuba ii-athomu ze-tantalum zikhutshwe kwindawo ekujoliswe kuyo kwaye zifakwe kwi-substrate ngendlela yefilimu encinci. Inkqubo ivumela ulawulo oluchanekileyo lobunzima befilimu kunye nokufana, okwenza kube yindlela ebalulekileyo yokuvelisa izixhobo zombane kunye nezinye iimveliso eziphezulu. Iithagethi ze-Tantalum sputtering zixabiswa ngenxa yendawo ephezulu yokunyibilika, ukunganyangeki kweekhemikhali, kunye nokuhambelana nezixhobo ezahlukeneyo ze-substrate, ezibenza zibe zilungele izicelo ezifuna iifilimu ezihlala ixesha elide kunye neziphezulu. Ezi thagethi zisetyenziswa ngokuqhelekileyo kwimveliso ye-capacitors, iisekethe ezidibeneyo kunye nezinye izixhobo zombane.
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