I-W1 ecocekileyo ye-wolfram tungsten isikhephe sokugquma ivacuum

Inkcazelo emfutshane:

Isikhephe se-W1 esicocekileyo se-tungsten sihlala sisetyenziswa kwinkqubo yokugquma i-vacuum.Ezi zikhephe ziyilelwe ukuba ziqulathe kwaye zithuthe imathiriyeli ezifana neentsimbi okanye ezinye izinto kwiinkqubo zokufunxa umphunga.Iqondo eliphezulu lokunyibilika kwe-tungsten ecocekileyo kunye ne-thermal conductivity egqwesileyo yenza kube yinto efanelekileyo kwesi sicelo, njengoko inokumelana namaqondo obushushu aphezulu kwaye ibonelele ngokufudumeza okufanayo okufunekayo ukufunxa izinto kwindawo yevacuum.


Iinkcukacha zeMveliso

Iithegi zeMveliso

  • Yintoni indlela yokufunxa umphunga yesinyithi?

Itekhnoloji yokufunxa umphunga yesinyithi ibandakanya ukufaka iifilimu ezicekethekileyo zentsimbi kwi-substrates kusetyenziswa indawo yofunxa ephezulu kunye nenkqubo yokubeka umphunga (PVD).Kule teknoloji, umthombo wesinyithi, onjenge-aluminiyam, igolide okanye isilivere, ifudunyezwa kwisikhephe somphunga, sibangele ukuba sibe ngumphunga kwaye sijiyane kwi-substrate ukwenza ifilimu yesinyithi ebhityileyo kunye neyunifomu.

Amanyathelo abandakanyekayo kwitekhnoloji ye-metalization vacuum evaporation ngokubanzi abandakanya:

1. Ukulungiselela: Coca i-substrate ukuba yenziwe ngetsimbi kwaye uyibeke kwigumbi lokucoca.

2. Ukuguquka kwamanzi: Beka imathiriyeli yesinyithi kwinqanawa ephuhlisayo, efana nephenyane le-tungsten, kwaye uyifudumeze kubushushu obuphuphumayo kwindawo yokufunxa ephezulu.Xa isinyithi siphuphuma, sihamba kumgca othe ngqo kwi-substrate.

3. I-Deposition: Umphunga wesinyithi udibanisa kwi-substrate ukwenza ifilimu encinci ebambelela kumphezulu.

4. Ukukhula kwefilimu: Inkqubo yokubeka iyaqhubeka de kufike ubungakanani obufunwayo befilimu yentsimbi.

5. Ukucutshungulwa okulandelayo: Emva kwe-metallization, i-substrate inokuthi ithathe amanyathelo ongezelelweyo okusebenza, njenge-annealing okanye i-coating, ukuphucula iimpawu zefilimu yensimbi.

Itekhnoloji ye-vacuum evaporation metallization isetyenziswa ngokubanzi kumashishini afana ne-electronics, optics, kunye ne-automotive, apho iifilimu zetsimbi zifakwa kwi-substrates ukufezekisa ukugqitywa, ukubonakalisa, okanye ukuhombisa.

isikhephe setungsten (3)
  • Uyintoni umthombo wokufukula kwevacuum?

Umthombo wokufunxa umphunga kwiinkqubo zokubeka ifilimu ecekethekileyo idla ngokuba yindawo yokufunxa ephezulu eyenziweyo kwigumbi lokufunxa.Igumbi lokucoca lixhotyiswe ngempompo yokucoca esusa umoya kunye nezinye iigesi ukudala indawo ephantsi yoxinzelelo.Iimpompo ze-vacuum zinokuba ziindidi ezahlukeneyo, ezinje ngeempompo ze-rotary vane, iimpompo zokusasaza okanye iimpompo ze-turbomolecular, kuxhomekeke kwiimfuno ezithile zenkqubo.

Nje ukuba igumbi lokufutha lifikelele kwindawo efunekayo yoxinzelelo oluphantsi, izinto eziza kwenziwa zibe ngumphunga zifudunyezwe kwisikhephe somoya (njenge-W1 Pure Tungsten Boat) kusetyenziswa ukufudumeza okuxhathisayo okanye ukufudumeza kwe-electron beam.Xa izinto zifikelela kubushushu balo bomphunga, ziyaphuphuma kwaye zihambe ngendlela ethe tye kwi-substrate, apho idibanisa khona ukuze yenze i-coating yefilimu encinci.

Ubume be-vacuum obuphezulu bubaluleke kakhulu kwimpumelelo yenkqubo yokukhupha i-vacuum njengoko inciphisa ubukho beamolekyu zegesi kunye nokungcola, okuvumela ukubekwa kweefilimu ezikumgangatho ophezulu, ezifanayo kwi-substrate.

Isikhephe seTungsten (6)

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