Sputter zvinangwazvinhu zvinoshandiswa kuisa mafirimu matete pane substrates panguva yemuviri vapor deposition (PVD) process. Zvinhu zvakanangwa zvinobhombwa nemaion ane simba guru, zvichiita kuti maatomu abudiswe kubva panzvimbo yakanangwa. Aya maatomu akapfapfaidzwa anobva aiswa pane substrate, achigadzira firimu rakatetepa. Sputtering targets inowanzoshandiswa mukugadzira semiconductors, masero ezuva uye zvimwe zvigadzirwa zvemagetsi. Izvo zvinowanzogadzirwa nesimbi, alloys kana makomisheni anosarudzwa zvichienderana nezvinodiwa zvemufirimu wakaiswa.

Iyo sputtering process inokanganiswa ne akati wandei paramita, kusanganisira:

1. Simba rekupfira: Kuwanda kwesimba rinoshandiswa panguva yekuputira kuchakanganisa simba reiyoni yakapwanyika, nekudaro ichikanganisa mwero wekupopota.

2. Kupwanya gasi rinomanikidza: Kumanikidzwa kwegasi rinoputika muimba yekamuri kunokanganisa kukurumidza kuendeswa kweoni dzakasvibiswa, nokudaro zvichikanganisa chiyero chekuputira uye kushanda kwefirimu.

3. Target properties: The physical and chemical properties of the sputtering target, senge kuumbwa kwayo, kuoma, kunyunguduka, nezvimwewo, zvinogona kukanganisa sputtering process uye kushanda kwefirimu yakaiswa.

4. Chinhambwe chiri pakati pechinangwa nechikamu chepasi: Chinhambwe chiri pakati pechinangwa chekupopotera nechikamu chinozokanganisa mafambiro uye simba remaatomu akapfachuka, zvichizokanganisa chiyero chekuisa uye kufanana kwefirimu.

5. Kuwanda kwesimba: Kuwanda kwesimba rinoshandiswa kune chinangwa chepamusoro kunokanganisa sputtering rate uye kushanda kwemaitiro ekuputika.

Nekunyatso kudzora uye nekugonesa aya ma paramita, iyo sputtering process inogona kugadzirwa kuti iwane inodiwa firimu zvimiro uye deposition mitengo.