Ukuhlanzeka okuphezulu kwe-Ion yokufakelwa i-tungsten filament
I-ion implantation tungsten wire iyingxenye ebalulekile esetshenziswa emishinini yokufakelwa kwe-ion, ikakhulukazi ezinqubweni zokukhiqiza ze-semiconductor. Lolu hlobo lwentambo ye-tungsten ludlala indima ebalulekile kumishini ye-semiconductor, futhi ikhwalithi yayo nokusebenza kwayo kuthinta ngokuqondile ukusebenza kahle kwemigqa yenqubo ye-IC. Umshini wokufakelwa kwe-Ion uyisisetshenziswa esibalulekile enqubweni yokukhiqiza ye-VLSI (Isikali Esikhulu Esididiyelwe Sesekethe), futhi indima yocingo lwe-tungsten njengomthombo we-ion ayikwazi ukushaywa indiva. .
| Ubukhulu | Njengemidwebo yakho |
| Le yindawo ka Origin | Luoyang, Henan |
| I gama le-brand | FGD |
| Isicelo | i-semiconductor |
| Ubuso | Isikhumba esimnyama, ukugeza kwe-alkali, ukukhanya kwemoto, okupholishiwe |
| Ubumsulwa | 99.95% |
| Okubalulekile | W1 |
| Ukuminyana | 19.3g/cm3 |
| Izindinganiso zokwenza | I-GB/T 4181-2017 |
| Iphoyinti lokuncibilika | 3400 ℃ |
| Okuqukethwe ukungcola | 0.005% |
| Izingxenye eziyinhloko | W＞99.95% |
| Okuqukethwe ukungcola≤ | |
| Pb | 0.0005 |
| Fe | 0.0020 |
| S | 0.0050 |
| P | 0.0005 |
| C | 0.01 |
| Cr | 0.0010 |
| Al | 0.0015 |
| Cu | 0.0015 |
| K | 0.0080 |
| N | 0.003 |
| Sn | 0.0015 |
| Si | 0.0020 |
| Ca | 0.0015 |
| Na | 0.0020 |
| O | 0.008 |
| Ti | 0.0010 |
| Mg | 0.0010 |
1. Imboni yethu itholakala eLuoyang City, esifundazweni saseHenan. I-Luoyang iyindawo yokukhiqiza yezimayini ze-tungsten ne-molybdenum, ngakho-ke sinezinzuzo eziphelele ngekhwalithi namanani;
2. Inkampani yethu inabasebenzi bezobuchwepheshe abaneminyaka engaphezu kwengu-15 yesipiliyoni, futhi sinikeza izixazululo neziphakamiso ezihlosiwe zezidingo zekhasimende ngalinye.
3. Yonke imikhiqizo yethu ihlolwa ngokuqinile ikhwalithi ngaphambi kokuthunyelwa kwamanye amazwe.
4. Uma uthola izimpahla ezingalungile, ungaxhumana nathi ukuze uthole imbuyiselo.
1.Ukukhetha impahla eluhlaza
(Khetha izinto zokusetshenziswa ze-tungsten zekhwalithi ephezulu ukuze uqinisekise ubumsulwa kanye nezakhiwo zemishini zomkhiqizo wokugcina.)
2. Ukuncibilika kanye Nokuhlanzwa
(Izinto zokusetshenziswa ze-tungsten ezikhethiwe ziyancibilika endaweni elawulwayo ukuze kukhishwe ukungcola futhi kufinyelele ubumsulwa obufunekayo.)
3. Umdwebo wocingo
(Impahla ye-tungsten ehlanzekile iyakhushulwa noma idwetshwe ngochungechunge lwamafa ukuze kuzuzwe ububanzi bocingo obudingekayo kanye nezakhiwo zokukhanda.)
4.Ukukhipha
(Intambo ye-tungsten edonsayo idonswa ukuze kuqedwe ingcindezi yangaphakathi futhi kuthuthukiswe i-ductility yayo nokusebenza kokucubungula)
5. Inqubo Yokufakwa Kwe-Ion
Kulesi simo, umcu we-tungsten ngokwawo ungase ubhekane nenqubo yokufakelwa kwe-ion, lapho ama-ion ejovwa khona ebusweni bomucu we-tungsten ukuze kushintshwe izici zawo ukuze kuthuthukiswe ukusebenza kusifakeli se-ion.)
Enqubweni yokukhiqiza i-chip ye-semiconductor, umshini wokufakelwa kwe-ion ungomunye wemishini ebalulekile esetshenziselwa ukudlulisa umdwebo wesifunda se-chip usuka kumaski uye ku-silicon wafer futhi uzuze umsebenzi we-chip oqondiwe. Le nqubo ihlanganisa izinyathelo ezifana nokupholisha amakhemikhali, ukufakwa kwefilimu encane, i-photolithography, i-etching, kanye nokufakelwa kwe-ion, phakathi kwayo ukufakwa kwe-ion kungenye yezindlela ezibalulekile zokuthuthukisa ukusebenza kwama-silicon wafers. Ukusetshenziswa kwemishini yokufakelwa kwe-ion kulawula ngempumelelo isikhathi nezindleko zokukhiqiza ama-chip, kuyilapho kuthuthukisa ukusebenza nokuthembeka kwama-chips. .
Yebo, ama-tungsten filaments angangcoliswa ngesikhathi senqubo yokufakelwa kwe-ion. Ukungcola kungase kwenzeke ngenxa yezinto ezihlukahlukene, njengamagesi ayinsalela, izinhlayiya, noma ukungcola okukhona ekamelweni lokufakelwa kwe-ion. Lokhu kungcola kungabambelela ebusweni bomucu we-tungsten, kuthinte ubumsulwa bayo futhi kuphazamise ukusebenza kwenqubo yokufakelwa kwe-ion. Ngakho-ke, ukugcina indawo ehlanzekile futhi elawulwayo ngaphakathi kwegumbi lokufakelwa kwe-ion kubalulekile ekunciphiseni ingozi yokungcola nokuqinisekisa ubuqotho be-tungsten filament. Izinqubo ezijwayelekile zokuhlanza nokulungisa zingasiza futhi ekwehliseni amandla okungcola ngesikhathi sokufakwa kwe-ion.
I-Tungsten wire yaziwa ngendawo yayo ephezulu yokuncibilika kanye nezakhiwo ezinhle kakhulu zemishini, eziyenza imelane nokuguqulwa ngaphansi kwezimo ezijwayelekile zokufakelwa kwe-ion. Kodwa-ke, ukushisa okukhiqizwa ngesikhathi sokuqhuma kwebhomu le-ion enamandla amakhulu kanye nokufakwa kwe-ion kungabangela ukuhlanekezela ngokuhamba kwesikhathi, ikakhulukazi uma amapharamitha wenqubo engalawulwa ngokucophelela.
Izinto ezifana nokuqina nobude be-ion beam kanye nezinga lokushisa nengcindezi etholwa intambo ye-tungsten konke kungaba nomthelela emandleni okuguquka. Ukwengeza, noma yikuphi ukungcola noma amaphutha ocingweni lwe-tungsten kuzokwandisa ukuthambekela kokuguga.
Ukuze kuncishiswe ingozi yokuguqulwa, imingcele yenqubo kufanele iqashwe futhi ilawulwe ngokucophelela, ukuhlanzeka kanye nekhwalithi ye-tungsten filament kufanele kuqinisekiswe, futhi izinqubo ezifanele zokugcinwa nokuhlola kufanele zisetshenziswe imishini yokufakelwa kwe-ion. Ukuhlola njalo isimo nokusebenza kwentambo ye-tungsten kungasiza ekuboneni noma yiziphi izimpawu zokuhlanekezela futhi kuthathe isinyathelo sokulungisa njengoba kudingeka.
