Sputter targets are materials used to deposit thin films onto substrates during the physical vapor deposition (PVD) process.  The target material is bombarded with high-energy ions, causing atoms to be ejected from the target surface.  These sprayed atoms are then deposited onto a substrate, forming a thin film.  Sputtering targets are commonly used in the production of semiconductors, solar cells and other electronic devices.  They are usually made of metals, alloys or compounds that are selected based on the desired properties of the deposited film.

The sputtering process is affected by several parameters, including:

1. Sputtering power: The amount of power applied during the sputtering process will affect the energy of the sputtered ions, thereby affecting the sputtering rate.

2. Sputtering gas pressure: The pressure of the sputtering gas in the chamber affects the momentum transfer of sputtered ions, thereby affecting the sputtering rate and film performance.

3. Target properties: The physical and chemical properties of the sputtering target, such as its composition, hardness, melting point, etc., can affect the sputtering process and the performance of the deposited film.

4. The distance between the target and the substrate: The distance between the sputtering target and the substrate will affect the trajectory and energy of the sputtered atoms, thereby affecting the deposition rate and uniformity of the film.

5. Power density: The power density applied to the target surface affects the sputtering rate and the efficiency of the sputtering process.

By carefully controlling and optimizing these parameters, the sputtering process can be tailored to achieve desired film properties and deposition rates.